Coriant and SIAE MICROELETTRONICA to Demonstrate SDN-Enabled Multi-Layer Microwave and MillimetreWave Backhaul Capabilities for 5G Networks

Interoperability Testing to Feature Fast End-to-End Provisioning and High-Speed Service Flexibility across SDN-Enabled Transport Domains

Coriant, a global supplier of open, disruptive, and hyperscale networking solutions, and SIAE MICROELETTRONICA, a leader in wireless communication, today announced a collaboration to demonstrate SDN-enabled Layer 3 microwave and millimetre-wave backhaul solutions optimized for the high-capacity, low latency demands of next-generation services and applications, including 5G and IoT.

Working closely with a European Tier 1 mobile operator, this multi-vendor, multi-layer Proof of Concept (PoC) will showcase the interworking of the SIAE MICROELETTRONICA SM-DC microwave-domain controller and the Coriant Transcend™ Maestro hierarchical controller to orchestrate on-demand Layer 3 service creation and provisioning across SIAE MICROELETTRONICA Layer 3 microwave/millimetre-wave and Coriant packet-optical transmission domains. The collaboration aims to demonstrate SDN-enabled network readiness for deployment and the advantages this solution brings across the network and the companies’ commitment toward this framework.

“We believe SDN orchestration allows operators to focus on service creation and management with unprecedented flexibility, regardless of the underlining transport technology,” said Paolo Galbiati, Head of Product Line, SIAE MICROELETTRONICA. “We are excited to team with Coriant to demonstrate the tangible benefits of our joint efforts.”

“This collaboration reinforces our commitment to open networking and our unwavering focus on helping network operators address the practical challenges of transitioning to SDN-enabled network control across a diverse set of multi-vendor transport architectures and applications,” said Mikko Hannula, Vice President, Engineering and Product Management, Coriant.

Source: Coriant media announcement